Detection of Organic Additives in Copper Plating Bath Using Voltammetric Methods That Involve a Screen-printed Nano-Au Electrode
Yu-Ching Weng *
Department of Chemical Engineering, Feng Chia University, Taichung 40724, Taiwan.
Jhih-Jie Huang
Department of Chemical Engineering, Feng Chia University, Taichung 40724, Taiwan.
Chih-Yao Wang
Electronic and Optoelectronic System Research Laboratories, Industrial Technology Research Institute, Hsinchu, 31040, Taiwan.
Miao-Zhen Hong
Electronic and Optoelectronic System Research Laboratories, Industrial Technology Research Institute, Hsinchu, 31040, Taiwan.
*Author to whom correspondence should be addressed.
Abstract
Three electrochemical methods used to detect organic additives, A, B and C, in acidic plating baths. Cyclic voltammetric stripping (CVS) is used in industry to detect the concentration of organic additives indirectly by measuring the effect of commercial organic additives on the rate of copper deposition. This study directly determines the concentration of organic additives on a screen-printed nano-Au electrode at high potential using three different electrochemical methods: linear scanning voltammetry (LSV), differential pulse voltammetry (DPV) and square wave voltammetry (SWV). The results show that the response currents for the three electrochemical methods exhibit a linear relationship with the concentration of organic additives. The nano-Au electrode is the most sensitive device for the detection of organic additive B using LSV.
Keywords: Copper electroplating additives, sensor, nano-Au electrode, concentration detection